FUJITSU SEMICONDUCTOR
SUPPORT SYSTEM
SS01-71050-1E
DSU-FR EMULATOR
LQFP-176P HEADER TYPE 3
MB2198-301
OPERATION MANUAL
■ Caution of the products described in this document
The following precautions apply to the product described in this manual.
Indicates a potentially hazardous situation which, if not avoided appropriately,
could result in death or serious injury and/or a fault in the user’s system.
WARNING
Before performing any operation described in this manual, turn off all the power
supplies to the system. Performing such an operation with the power on may
cause an electric shock or device fault.
Electricshock,
Damage
Electricshock,
Damage
Once the product has been turned on, do not touch any metal part of it.
Doing so may cause an electric shock or device fault.
Indicates a potentially hazardous situation which, if not avoided appropriately, may
result in minor or moderate injury and/or damage to the product or the equipment
to which the product is connected, to software resources such as data, or to other
properties.
CAUTION
Before moving the product, be sure to turn off all the power supplies and unplug the
cables. Watch your steps when carrying the product. Do not use the product at an
unstable location such as a place exposed to strong vibration or a sloping surface.
Doing so may let the product fall, resulting in an injury or fault.
Cuts, Damage
The product has some sharp-pointed or edged parts inevitably exposed, such as
jumper plugs. Use meticulous care in handling the product not to get injured with
such pointed parts.
Cuts
Neither put anything on or apply shock to the product. Once the product has been
powered, do not carry it. Doing either may cause a fault due to a load or shock.
Damage
Since the product contains many electronic components, keep it away from direct
sunlight, high temperature, and high humidity to prevent condensation. Do not use
or store the product where it is exposed to much dust or a strong magnetic or elec-
tric field for an extended period of time.
Damage
An adverse operating or storage environment can cause a fault.
Use the product within the ranges of its general specifications.
Operating it outside the range of any general specification may cause a fault.
Damage
Damage
To prevent electrostatic breakdown, do not let your finger or an object touch any
metal part of the connector. Before handling the product, touch a metal object (such
as a door knob) to discharge static electricity from your body.
When turning the power on or off, follow the relevant procedure described in this
document. Before turning the power on, in particular, be sure to finish making all the
required connections. To set up and use the product, follow the instructions given
in this document.
Damage
Damage
Using the product incorrectly or inappropriately may cause a fault.
Before plugging or unplugging any cable for this product, be sure to turn the power
supply off. When unplugging the cable, remove it while holding the connector with-
out pulling the cable itself. Pulling the cable itself or bending it may expose or dis-
connect the cable core, resulting in a fault.
Although the MCU socket is structured not to accept an evaluation MCU in a wrong
orientation or position, pay due attention to the mounting orientation when mounting
the evaluation MCU. Forcing the evaluation MCU to be inserted in a wrong orienta-
tion can damage the pins of the evaluation MCU and the accidental insertion pre-
vention mechanism of the socket, resulting in a fault.
Damage
Damage
When stored, the product should be kept in its packaging box as it has no housing.
Re-transporting the product may damage it to cause a fault. Keep the packaging
materials used for shipment of the product and use them when re-transporting it.
ii
• The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
• The information, such as descriptions of function and application circuit examples, in this document are presented sole-
ly for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU
does not warrant proper operation of the device with respect to use based on such information. When you develop
equipment incorporating the device based on such information, you must assume any responsibility arising out of such
use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the infor-
mation.
• Any information in this document, including descriptions of function and schematic diagrams, shall not be construed
as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right
of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property
right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result from the use of information contained herein.
• The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air
traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)
for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in
connection with above-mentioned uses of the products.
• Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from
such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire pro-
tection, and prevention of over-current levels and other abnormal operating conditions.
• If any products described in this document represent goods or technologies subject to certain restrictions on export un-
der the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be
required for export of those products from Japan.
©2005 FUJITSU LIMITED Printed in Japan
iii
1. Product Overview
1.1 Overview
This product is an option product for use with the DSU-FR emulator and is intended to support the
development of user systems that use the Fujitsu FR family of microcontrollers.
The main features of the header board are as follows.
• Used in conjunction with the adapter (separately available) to connect the user system to an
emulator.
• When using the MB91V460 to emulate an MB91460 series MCU, the header board performs
level shifting the 5 V output signals of MB91V460 or user system to 3.3 V.
1.2 Check package contents
Before starting to use the header board, check that the following items are all present.
• LQFP-176P header *1
: 1
: 4
• Header board attachment screws
(M2 × 10 mm, 0.4 mm pitch)
• Washers
• NQPACK176SD *2
• HQPACK176SD *3
: 4
: 1
: 1
: 1
: 1
• Operation Manual (Japanese)
• Operation Manual (English, this document)
*1 : Referred to below as the "header board". The header board installs the adapter I/F connector
and YQPACK176DS (Tokyo Eletech Corporation, referred to below as the “YQPACK”) .
*2 : IC socket (Tokyo Eletech Corporation, referred to below as the "NQPACK") . Includes a ded-
icated screwdriver and three guide pins. If you provide the required screw holes in printed cir-
cuit board for user system for attaching the IC socket, you can use the highly reliable
NQPACK176SD-SL adapter socket (Tokyo Eletech Corporation, sold separately) . Please con-
tact Tokyo Eletech for details.
*3 : IC socket cover (Tokyo Eletech Corporation, referred to below as the “HQPACK”) . Four
screws (M2 × 6 mm, 0.4 mm pitch) are supplied for attaching the HQPACK.
Please contact Fujitsu sales or support representative for details of which mass production MCU
models can be used with this product.
1
1.3 Option Products
Table 1.1 shows the option products available for the header board. Please purchase these separately,
as required.
Table 1.1 Option Products
Name
Model
DSU-FR emulator
DSU-FR cable
MB2198-01
MB2198-10
MB2198-300
MB91V460
BGA-660P adapter *1
Evaluation MCU *2
*1 : When used together with the BGA-660P adapter for the DSU-FR Emulator (Model No:
MB2198-300) , the header board can be used as an adapter unit.
Refer to the "DSU-FR Emulator MB2198-300 BGA-660P Adapter Operation Manual" for de-
tails including how to handle the adapter, how to use it, and safety precautions.
*2 : Evaluation MCUs are mounted in the adapter. Please contact Fujitsu sales or support represen-
tative for details of evaluation MCU corresponding to another adapter.
2
1.4 System Configuration
The header board is used together with an emulator, adapter, and other components to connect to the
user system.
Figure1.1 shows the system configuration to this product.
Host computer
General-purpose
External trigger/
measurement
equipment
RS232C, USB, LAN
program execution
AC in
AC adapter
DSU-FR emulator unit
DSU-FR
cable
AC adapter
AC in
Evaluation
MCU
Adapter
Header board
User system
Figure 1.1 System Configuration
To use the emulator, a host computer and emulator/debugger software are required separately. Please
refer to the operation manual for the adapter for details about how to connect the adapter and header
board. Refer to the header board's hardware manual, operation manual, and other support documen-
tation for details of the emulator, adapter, and other specifications.
3
1.5 External View and Names of Each Part
Figure 1.2 shows the external view of the header board and the names of each part.
Note that Figure 1.2 shows the state of the header board when it is shipped.
2
1
10
9
8
7
6
5
4
3
No.
■
■
■
■
■
Part
No.
■
■
■
■
■
Part
Adapter I/F connector 1
Adapter I/F connector 2
VCC5 jumper plug
YQPACK
VCCB2 jumper plug
VCCB1 jumper plug
VCCB5 jumper plug
Pull-up resistor
VCCB4 jumper plug
VCCB3 jumper plug
Figure 1.2 External View of Header Board
4
2. Precautions When Using this Product
Take the precautions and restrictions below when using the header board.
■ Precautions
• Operating the device outside the range of any general specification may cause the device to
malfunction. Use the device in the ranges of its general specifications.
• Please follow this manual about setting and using the adapter.
• Table 2.1 lists the temperature and humidity ranges for operating and storing the unit.
Table 2.1 Operation and Storage Conditions
Temperature
5 °C to 35 °C
0 °C to 70 °C
Humidity
Operation
Storage
20 % to 80 % (with no condensation)
20 % to 80 % (with no condensation)
■ Points to note when designing the printed circuit board for the user system
A height restriction applies to any components on the user system that are located close to where the
header board connects to the user system.
Take note of this when designing the printed circuit board for the user system.
72 mm
115 mm
Adapter
Insulating plate
Header
approx 17 mm.
1.6 mm
10 mm
approx 13 mm.
User system
NAPACK176SD
* : The height differs slightly depending on how the YQPACK and the NQPACK are engaged.
Figure 2.1 Header Board Dimensions
5
■ Points to note when designing the MCU foot pattern
The figure shows the recommended foot pattern dimensions for mounting the NQPACK on the print-
ed circuit board for the user system. Please take account of the NQPACK foot pattern requirements
as well as the recommended foot pattern for the mass production MCU when designing the printed
circuit board for the user system.
Contact Tokyo Eletech Co. Ltd. for more details.
0.5 × 43 = 21.5 mm
0.25 mm
0.5 mm
10 mm
No.1 Pin
φ 3.2 mm SL-type
3- φ 1.0 mm
*1 : Position of guide pin holes (φ 1.0 mm) used to align the NQPACK when mounting. These
holes are not required if not using the guide pins.
*2 : Position of IC socket attachment screw holes (φ 3.2 mm) required if using the
NQPACK176SD-SL (sold separately by Tokyo Eletech Corporation) instead of the
NQPACK176SD supplied with the header board.
These holes are not required if not using the NQPACK176SD-SL.
Figure 2.2 Foot Pattern Dimensions for Mounting the NQPACK
■ Restrictions
The following general restrictions apply to the header board.
• When using the adapter and header, the MCU on the user system must be mounted in a socket.
Use the NQPACK176SD (Tokyo Eletech Corporation) as the IC socket.
• Ensure that all power is turned off to the adapter, emulator, and user system before setting the
jumpers on the header board.
• The configuration of the level shift circuit is such that VOH for signals that expect a 4.5 V
output is limited to 4.4 V.
• As no level shift function is provided for pins 89 to 108, the output signal level depends on
the power supply used to drive these pins.
6
3. Connection
3.1 Connecting the Header Board to the User System
Mount the supplied NQPACK on the user system before using the header board.
The header board is used together with the adapter.
Refer to the hardware manual for the adapter for details about how to connect the header board and
adapter.
■ Connection procedure
1. To connect the header board to the user system, align the index mark (■) on the header board
with pin 1 on the NQPACK mounted on the user system. Pin 1 on the NQPACK is also indicated
by an index mark (■) (See Figure 3.1) .
As the YQPACK pins are thin and easily bent, check that the YQPACK pins are kept straight
when inserting into the NQPACK.
2. Insert the header board attachment screws, together with washers, into the four screw holes in the
top of the header board and tighten the diagonally opposite screws in turn (See Figure 3.2) .
Use the dedicated screwdriver supplied with the NQPACK to tighten the screws and tighten each
screw equally in turn. Take care not to over-tighten as this may cause a bad connection.
1 7 6 S D
T E T
Header board
NQPACK
index (■)
Index (■)
Figure 3.1 Index Positions
7
Header board
attachment screws
Washers
Header board
YQPACK
NQPACK
User system
Figure 3.2 Header Board Connection Procedure
■ Disassembly procedure
To remove the header board, first remove the four screws and then lift the header board vertically
up/off the NQPACK.
8
3.2 Mounting a Mass Production MCU Model
Use the supplied HQPACK to mount the mass production MCU in the user system.
1. Align the index mark on the mass production MCU (■) with the index mark on the NQPACK
mounted on the user system (■), and then insert.
2. Check that the mass production MCU is correctly inserted into the NQPACK, and then align the
index marks on the HQPACK and NQPACK (angle cut linearly at one place only) and insert
(See Figure 3.3).
As the HQPACK pins are thin and easily bent, check that the HQPACK pins are kept straight
when inserting into the NQPACK.
3. Insert the four screws for attaching the HQPACK into the four screw holes in the top of the HQ-
PACK and tighten the diagonally opposite screws in turn.
Use the dedicated screwdriver supplied with the NQPACK to tighten the screws and tighten each
screw equally in turn. Take care not to over-tighten as this may cause a bad connection.
Attachment screws
HQPACK
Mass Production MCU
NQPACK
User system
Figure 3.3 Mounting a Mass Production MCU Model
■ Disassembly procedure
To remove the HQPACK, first remove the four screws and then lift the HQPACK vertically up/off
the NQPACK.
9
4. Operation
The following describes how to set the various settings, and the procedure for turning the power on
and off. Be sure to read the setting as shown below before turning on the power.
4.1 Jumper Plug Settings
■ VCC5 jumper plug setting
Figure 4.1 shows the factory setting and setting meaning of VCC5 jumper plugs.
Please set it to the terminal number in which the terminal VCC3 is impressed to a different voltage
among terminals VCC5 of mass production MCU (The terminal number: 133,147,162,176) . More-
over, please set it to either of terminal even when you use mass production MCU in a single power
supply.
VCC5
S6
NC
133
NC
147
NC
176
NC
162
Setting
133
Meaning
Apply voltage at pin 133 of the mass production MCU, voltage being different from the
VCC3 pin.
Apply voltage at pin 147 of the mass production MCU, voltage being different from the
VCC3 pin.
147
162
176
Apply voltage at pin 162 of the mass production MCU, voltage being different from the
VCC3 pin.
Apply voltage at pin 176 of the mass production MCU, voltage being different from the
VCC3 pin.
Figure 4.1 VCC5 Jumper Plug Settings
10
■ VCCB1 to VCCB5 settings
Figure 4.2 describes the factory setting of VCCB1 to VCCB5 jumper plugs and the setting of the
jumper plugs.
S4
VCC5H
VCC3H
VCCB4
VCCB3
S3
VCC3H
VCC5H
VCC5H
VCC5H
VCC5H
VCCB2
S2
VCC3H
VCCB1
S1
VCC3H
VCCB5
S5
VCC3H
Jumper
plug
Setting
VCC5H
VCC3H
VCC5H
VCC3H
VCC5H
VCC3H
VCC5H
VCC3H
VCC5H
VCC3H
Meaning
Remarks
Adjust the level of group 1 output signals Select this setting if connecting a 5 V
to 4.4 V. 10 % power supply to pin 176.
Adjust the level of group 1 output signals Select this setting if connecting a 3.3 V
between 3.6 V and 3.0 V. 0.3 V power supply to pin 176.
Adjust the level of group 2 output signals Select this setting if connecting a 5 V
to 4.4 V. 10 % power supply to pin 162.
Adjust the level of group 2 output signals Select this setting if connecting a 3.3 V
between 3.6 V and 3.0 V. 0.3 V power supply to pin 162.
Adjust the level of group 3 output signals Select this setting if connecting a 5 V
to 4.4 V. 10 % power supply to pin 147.
Adjust the level of group 3 output signals Select this setting if connecting a 3.3 V
between 3.6 V and 3.0 V. 0.3 V power supply to pin 147.
Adjust the level of group 4 output signals Select this setting if connecting a 5 V
to 4.4 V. 10 % power supply to pin 133.
Adjust the level of group 4 output signals Select this setting if connecting a 3.3 V
between 3.6 V and 3.0 V. 0.3 V power supply to pin 133.
Adjust the level of group 5 output signals Select this setting if connecting a 5 V
to 4.4 V. 10 % power supply to the VCC3 pin.
Adjust the level of group 5 output signals Select this setting if connecting a 3.3 V
between 3.6 V and 3.0 V. 0.3 V power supply to the VCC3 pin.
VCCB1
VCCB2
VCCB3
VCCB4
VCCB5
Figure 4.2 VCCB1 to VCCB5 Jumper Plug Settings
11
For method to select each jumper plug, when the power supply connected to VCC3 is 3.3 V 0.3 V,
VCCB5 should be set to VCC3H. In this case, the jumper plugs corresponding to the VCC5 pins that
have a power supply with a voltage different to VCC3 (5 V 10 %) should be set to VCC5H. The
jumpers for the pins with the same power supply voltage as VCC3 should be set to VCC3H. The
following shows an example.
Example
VCC3 = 3.3 V
Pin 133 (VCC5) = 3.3 V
Pin 147 (VCC5) = 5 V
Pin 162 (VCC5) = 5 V
Pin 176 (VCC5) = 5 V
Jumper plug settings
VCCB1 = VCC5H
VCCB2 = VCC5H
VCCB3 = VCC5H
VCCB4 = VCC3H
VCCB1 = VCC3H
When the power supply connected to VCC3 is 5 V 10 %, VCCB5 should be set to VCC5H. In this
case, the jumper plugs corresponding to the VCC5 pins that have a power supply with a voltage dif-
ferent to VCC3 (3.3 V 0.3 V) should be set to VCC3H. The jumpers for the pins with the same
power supply voltage as VCC3 should be set to VCC5H. The following shows an example.
Example
VCC3 = 5 V
Pin 133 (VCC5) = 3.3 V
Pin 147 (VCC5) = 5 V
Pin 162 (VCC5) = 5 V
Pin 176 (VCC5) = 5 V
Jumper plug settings
VCCB1 = VCC5H
VCCB2 = VCC5H
VCCB3 = VCC5H
VCCB4 = VCC3H
VCCB1 = VCC5H
If connecting a single power supply (5 V 10 % or 3.3 V 0.3 V) to both VCC3 and VCC5, the unit
will operate correctly regardless of the settings (VCC5H or VCC3H) .
4.2 Use of Pull-Up Resistor
■ Use of pull-up resistor
A 100 kΩ pull-up resistor is connected to pin 99 on the mass production MCU which connects to the
VCC3 power supply.
The output signal from the header to this pin does not contain any component other than the pull-up.
If this pull-up component is not required by the user system, please remove the resistor.
12
5. Specifications
5.1 General specifications
Table 5.1 lists the general specifications of the header board.
Table 5.1 General Specifications
Specification
Item
Remarks
LQFP-176P Header Type 3
(Model No.: MB2198-301)
Product name (model no.)
⎯
VCC5
(note)
Supplied for user
system
3.0 V to 5.5 V
User system power supply
Header power supply
VCC3
(note)
Supplied for user
system
3.0 V to 5.5 V
Supplied for adapter
Requires level shifter
VCC5H
VCC3H
UVCC5+1 V (lower limit 4.0 V, upper limit 5.4 V)
UVCC3+1 V (lower limit 4.0 V, upper limit 5.4 V)
Supplied for adapter
Requires level shifter
Operating temperature and storage tem- Operation: 5 °C to 40 °C
No condensation
No condensation
perature
Storage : 0 °C to 70 °C
Operation: 20 % to 80 %
Storage: 20 % to 80 %
Operating humidity and storage humidity
External dimensions
Weight
150 mm (W) × 115 mm (D) × 23 mm (H)
⎯
⎯
84.8 g
Note : The operating voltage range may be differed for some evaluation MCUs.
13
5.2 Function Specifications
Table 5.2 lists the function specifications of the header board.
Table 5.2 Function Specifications of Header Board
Specification
Item
Header board
Connects the user system and adapter.
The header board includes a level shifter used to convert the VCC5 level output signals of
the MB91V460 or user system to the VCC3 level when using the MB91V460 (evaluation
MCU: user I/O uses a single VCC5 power supply) to emulate an MB91461 or other
MB91460 series mass production MCU (user I/O uses dual VCC5 and VCC3 power
supplies) .
The potential of level-shifted signals corresponding to VCC5 and VCC3 are in the range
upper limit = 4.4 V, lower limit = 3 V (error for each power supply is 1 V or less) .
Note that the circuit configuration means that I/O pins that expect VCC5 level signals will
have a signal level of 4.4 V or less.
The following shows an example of level shifting when VCC5 = 5 V and VCC3 = 3.3 V.
MB91V460
Level Shift
Mass Production MCU
VCC5 I/O pin input = 4.4 V
VCC3 I/O pin input = 3.3 V
VCC5 I/O pin output = 5 V
VCC3 I/O pin output = 3.3 V
VCC5 I/O pin output = 5 V
VCC5 I/O pin output = 5 V
VCC5 I/O pin input = 4.4 V
VCC5 I/O pin input = 3.3 V
→
→
←
←
Level shift function
The level shift function separates the power supply pins that drive the mass production
MCU's I/O pins (VCC3 pin, pin 133 (VCC5) , pin 147 (VCC5) , pin 162 (VCC5) , and pin
176 (VCC5) ) into five groups and sets up level shifting independently for each group. The
settings are specified using the VCCB1 to VCCB5 jumper plugs. Figure 5.1 shows the make
up of each group.
Note that level shifting is not performed for pins 89 to 108 on the mass production MCU.
Selects the power supply with different potential to VCC3 among the MB91461’s VCC5
pins (pin 176, 162, 147, or 133) and connects it to the adapter Use the VCC5 jumper plug
to set this selection.
Power supply
14
1
2
3
4
5
6
7
8
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
Group 1
(driven by pin 176)
Group 3
(driven by pin 147)
Group 2
(driven by pin 162)
Group 4
(driven by pin 133)
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
YQPACK
TOP View
Group 5
(driven by VCC3 pin)
Group 5
(driven by VCC3 pin)
Level shift
function not
supported
98
97
96
95
94
93
92
91
Group 5
(driven by VCC3 pin)
90
89
Figure 5.1 Grouping for Level Shift Function
15
5.3 Connector Specifications
■ YQPACK specifications
On the header board, the signals from the evaluation MCU mounted on the adapter are connected in
accordance with the mass production MCU pin layout (same layout as YQPACK) via the two adapt-
er interface connectors on the header board.
Refer to the data sheet or hardware manual of the mass production MCU for information about its
pin layout.
Tables 5.3, 5.4, 5.5, and 5.6 list the pin layouts for the adapter board interface connectors.
Note :
• The "A row" in the table titles refers to the side of the connector that has the polarity marking.
The "B row" refers to the other side.
• "O" in the CBTS column indicates that the signal goes from the YQPACK176SD to adapter
interface connector 1 or 2 via the level shifter (SN74CBTS16211, Texas Instruments Incor-
porated) .
• VCC3 connects to the VCC3 pin on the mass production MCU.
• VCC5 connects to VCC5 pins on the mass production MCU (pin 133, 147, 162, or 176) . Use
the VCC5 jumper plug on the header board to specify the pins to which to connect.
16
Table 5.3 Adapter Interface Connector 1 (Row A)
Mass
Production
MCU Pin No.
⎯
Mass
Production
MCU Pin No.
Connector
Pin No.
Connector
Pin No.
Pin Name CBTS
Pin Name CBTS
A1
A2
A3
VCC5
VCC5
WR1X
⎯
⎯
A51
A52
A53
⎯
⎯
9
GND
GND
⎯
⎯
⎯
27
26
⎯
⎯
24
25
22
DACKX0
A4
A5
A6
A7
A8
A9
WR0X
NC
NC
A54
A55
A56
A57
A58
A59
8
DREQ0
NC
⎯
⎯
⎯
10
⎯
⎯
⎯
⎯
DEOP0
NC
BGRNTX
RDX
⎯
⎯
⎯
NC
RDY
NC
A10
A11
A12
A13
23
⎯
⎯
18
BRQ
GND
GND
CS1X
A60
A61
A62
A63
⎯
⎯
⎯
NC
⎯
⎯
⎯
⎯
⎯
GND
GND
P141
169
A14
A15
19
16
CS0X
CS3X
A64
A65
168
171
P140
P143
A16
A17
A18
A19
A20
A21
A22
A23
17
⎯
15
⎯
⎯
⎯
⎯
29
CS2X
NC
A66
A67
A68
A69
A70
A71
A72
A73
170
⎯
⎯
⎯
⎯
⎯
⎯
158
P142
NC
⎯
⎯
⎯
⎯
⎯
⎯
⎯
CS4X
NC
NC
GND
GND
ASX
NC
NC
NC
GND
GND
P151
⎯
⎯
⎯
⎯
A24
A25
28
SYSCLK
NC
A74
A75
157
160
P150
P153
⎯
⎯
A26
A27
A28
A29
A30
A31
A32
A33
⎯
⎯
⎯
⎯
⎯
⎯
⎯
21
NC
NC
NC
NC
NC
GND
GND
IOWRX
⎯
⎯
⎯
⎯
⎯
⎯
⎯
A76
A77
A78
A79
A80
A81
A82
A83
159
⎯
⎯
⎯
⎯
⎯
⎯
⎯
P152
NC
NC
NC
NC
NC
NC
NC
⎯
⎯
⎯
⎯
⎯
⎯
⎯
A34
A35
A36
A37
A38
A39
A40
A41
A42
A43
A44
A45
A46
A47
A48
A49
A50
20
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
IORDX
NC
NC
NC
NC
NC
NC
GND
GND
NC
NC
NC
NC
NC
NC
NC
NC
A84
A85
A86
A87
A88
A89
A90
A91
A92
A93
A94
A95
A96
A97
A98
A99
A100
⎯
⎯
⎯
⎯
⎯
⎯
⎯
82
⎯
⎯
⎯
⎯
131
⎯
⎯
⎯
⎯
NC
GND
NC
NC
NC
NC
NC
NMIX
NC
NC
VCC5
GND
INITX
GND
NC
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
GND
VCC5H
17
Table 5.4 Adapter Interface Connector 1 (Row B)
Mass
Production
MCU Pin No.
Mass
Production
MCU Pin No.
Connector
Pin No.
Connector
Pin No.
Pin Name CBTS
Pin Name CBTS
B1
B2
B3
⎯
⎯
⎯
NC
NC
NC
⎯
⎯
⎯
B51
B52
B53
⎯
⎯
135
GND
GND
P211
⎯
⎯
B4
B5
B6
B7
B8
B9
⎯
⎯
⎯
⎯
⎯
83
NC
NC
NC
⎯
⎯
⎯
⎯
⎯
B54
B55
B56
B57
B58
B59
134
⎯
136
138
137
⎯
P210
NC
P212
P215
P214
NC
⎯
NC
NC
P167
⎯
B10
B11
B12
B13
⎯
⎯
NC
⎯
⎯
⎯
B60
B61
B62
B63
139
⎯
⎯
P216
GND
GND
NC
GND
GND
P171
⎯
⎯
⎯
⎯
173
⎯
B14
B15
B16
B17
B18
B19
172
175
174
85
P170
P173
P172
P175
P174
P177
B64
B65
B66
B67
B68
B69
165
167
166
119
118
5
P220
P223
P222
P225
P224
P227
84
87
B20
B21
B22
B23
86
⎯
P176
GND
GND
P181
B70
B71
B72
B73
4
⎯
⎯
P226
GND
GND
P231
⎯
⎯
⎯
⎯
⎯
155
123
B24
B25
154
P180
NC
B74
B75
122
125
P230
P233
⎯
⎯
B26
B27
B28
B29
B30
B31
B32
B33
156
⎯
⎯
⎯
⎯
⎯
⎯
P182
NC
NC
NC
NC
GND
GND
P191
B76
B77
B78
B79
B80
B81
B82
B83
124
⎯
163
P232
NC
P234
NC
P236
NC
NC
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
164
⎯
⎯
⎯
⎯
⎯
149
⎯
NC
B34
B35
B36
B37
148
⎯
150
P190
NC
P192
P195
B84
B85
B86
B87
⎯
⎯
⎯
⎯
NC
NC
NC
NC
⎯
⎯
⎯
⎯
⎯
152
B38
B39
B40
B41
B42
B43
151
⎯
153
⎯
⎯
P194
NC
P196
GND
GND
P201
B88
B89
B90
B91
B92
B93
⎯
⎯
⎯
⎯
⎯
⎯
NC
GND
NC
NC
NC
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
141
NC
B44
B45
B46
B47
B48
B49
B50
140
⎯
142
144
143
⎯
P200
NC
P202
P205
P204
NC
B94
B95
B96
B97
B98
B99
B100
⎯
14/31
⎯
⎯
⎯
VCC5
C *
NC
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
NC
NC
NC
VCC3H
⎯
⎯
⎯
145
P206
* : C (pin B95) is connected to pin 14 and pin 31 of the YQPACK176SD.
18
Table 5.5 Adapter Interface Connector 2 (Row A)
Mass
Production
MCU Pin No.
Mass
Production
MCU Pin No.
Connector
Pin No.
Connector
Pin No.
Pin Name CBTS
Pin Name CBTS
A1
A2
A3
⎯
⎯
117
VCC3
VCC3
P241
⎯
⎯
A51
A52
A53
⎯
⎯
101
GND
GND
P291
⎯
⎯
⎯
A4
A5
A6
A7
A8
A9
116
119
118
7
P240
P243
P242
P245
P244
P247
A54
A55
A56
A57
A58
A59
100
103
102
105
104
107
P290
P293
P292
P295
P294
P297
⎯
⎯
⎯
⎯
⎯
⎯
6
121
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
A25
A26
A27
A28
A29
A30
A31
120
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
P246
GND
GND
NC
NC
NC
NC
NC
NC
NC
A60
A61
A62
A63
A64
A65
A66
A67
A68
A69
A70
A71
A72
A73
A74
A75
A76
A77
A78
A79
A80
A81
106
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
36
P296
GND
GND
NC
NC
NC
NC
NC
NC
NC
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
NC
NC
GND
GND
NC
NC
NC
NC
NC
NC
NC
GND
GND
NC
NC
NC
NC
NC
NC
NC
NC
GND
NC
D16
A32
A33
A34
A35
A36
A37
A38
A39
A40
A41
A42
A43
A44
A45
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
109
108
111
GND
NC
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
A82
A83
A84
A85
A86
A87
A88
A89
A90
A91
A92
A93
A94
A95
38
40
D18
D20
NC
NC
NC
42
⎯
47
D22
GND
D25
⎯
NC
49
D27
NC
51
D29
NC
53
D31
NC
129
127
⎯
115
113
113
MD0
MD2
NC
AVRH
AVSS
AVSS
GND
GND
P281
P280
P283
⎯
⎯
⎯
⎯
⎯
A46
A47
A48
A49
A50
110
⎯
112
⎯
⎯
P282
NC
P284
NC
A96
A97
A98
A99
A100
⎯
⎯
⎯
⎯
⎯
VCC3
GND
NC
GND
GND
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
NC
19
Table 5.6 Adapter Interface Connector 2 (Row B)
Mass
Production
MCU Pin No.
Mass
Production
MCU Pin No.
Connector
Pin No.
Connector
Pin No.
Pin Name CBTS
Pin Name CBTS
B1
B2
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
GND
GND
NC
NC
NC
NC
NC
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
B51
B52
B53
B54
B55
B56
B57
B58
B59
B60
B61
B62
B63
B64
B65
B66
B67
B68
B69
63
62
64
⎯
66
65
68
67
70
69
⎯
71
75
72
77
76
79
78
81
A7
A6
A8
GND
A10
A9
B3
B4
B5
⎯
⎯
B6
B7
A12
A11
A14
A13
GND
A15
A17
A16
A19
A18
A21
A20
A23
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
B21
B22
B23
B24
B25
B26
B27
B28
B29
B30
B31
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
NC
NC
NC
GND
GND
NC
NC
NC
NC
NC
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
B70
B71
B72
B73
B74
B75
B76
B77
B78
B79
B80
B81
80
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
37
A22
NC
GND
NC
NC
NC
NC
NC
NC
GND
NC
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
NC
NC
D17
B32
B33
B34
B35
B36
B37
⎯
⎯
⎯
⎯
⎯
⎯
NC
GND
GND
NC
⎯
⎯
⎯
⎯
⎯
⎯
B82
B83
B84
B85
B86
B87
39
41
43
46
48
50
D19
D21
D23
D24
D26
D28
NC
NC
B38
B39
B40
B41
B42
B43
B44
B45
⎯
⎯
⎯
⎯
⎯
⎯
⎯
55
NC
NC
NC
NC
NC
GND
GND
A1
⎯
⎯
⎯
⎯
⎯
⎯
⎯
B88
B89
B90
B91
B92
B93
B94
B95
52
⎯
128
⎯
⎯
114
114
115
D30
GND
MD1
NC
NC
AVCC3
AVCC3
AVRH
⎯
⎯
⎯
⎯
⎯
⎯
B46
B47
B48
B49
B50
54
59
56
61
60
A0
A3
A2
A5
A4
B96
B97
B98
B99
B100
⎯
⎯
33
⎯
34
VCC3
GND
X0
⎯
⎯
GND
X1
⎯
20
SS01-71050-1E
FUJITSU SEMICONDUCTOR • SUPPORT SYSTEM
DSU-FR EMULATOR
LQFP-176P HEADER TYPE 3
MB2198-301
OPERATION MANUAL
December 2005 the first edition
Published FUJITSU LIMITED Electronic Devices
Edited Business Promotion Dept.
|