Philips Stereo Amplifier TDA1516BQ User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA1516BQ  
24 W BTL or 2 x 12 watt stereo car  
radio power amplifier  
July 1994  
Product specification  
File under Integrated Circuits, IC01  
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 watt stereo car radio  
power amplifier  
TDA1516BQ  
PACKAGE OUTLINE  
13-lead SIL-bent-to-DIL; plastic power (SOT141); SOT141-6; 1996 July 24.  
Fig.1 Block diagram.  
July 1994  
3
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 watt stereo car radio  
power amplifier  
TDA1516BQ  
PINNING  
1
2
3
4
5
6
7
INV1 non-inverting input 1  
INV inverting input  
GND1 ground (signal)  
reference voltage  
OUT1 output 1  
8
9
BS2  
OUT2 output 2  
V supply voltage  
P
bootstrap 2  
10  
V
11 M/SS mute/stand-by switch  
ref  
12 RR  
supply voltage ripple rejection  
BS1  
bootstrap 1  
13 INV2 non-inverting input 2  
GND2 ground (substrate)  
FUNCTIONAL DESCRIPTION  
The TDA1516BQ contains two identical amplifiers with differential input stages. This device can be used for stereo or  
bridge applications. The gain of each amplifier is fixed at 20 dB. A special feature of this device is the mute/stand-by  
switch which has the following features:  
low stand-by current (< 100 µA)  
low mute/stand-by switching current (low cost supply switch)  
mute condition.  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
PARAMETER  
Supply voltage  
CONDITIONS  
SYMBOL  
MIN.  
MAX.  
UNIT  
operating  
V
V
18  
30  
V
V
P
non-operating  
load dump protected  
P
during 50 ms;  
t 2,5 ms  
V
45  
V
r
P
A.C. and d.c. short-circuit-  
safe voltage  
V
V
18  
6
V
V
PSC  
Reverse polarity  
PR  
Energy handling capability  
at outputs  
V = 0 V  
200  
6
mJ  
A
P
Non-repetitive peak output  
current  
I
OSM  
Repetitive peak output  
current  
I
4
A
ORM  
Total power dissipation  
Crystal temperature  
Storage temperature range  
see Fig.2  
P
T
25  
W
°C  
°C  
tot  
150  
+ 150  
c
T
55  
stg  
July 1994  
4
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 watt stereo car radio  
power amplifier  
TDA1516BQ  
Fig.2 Power derating curve.  
July 1994  
5
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 watt stereo car radio  
power amplifier  
TDA1516BQ  
D.C. CHARACTERISTICS (note 1)  
V = 14,4 V; T  
= 25 °C; unless otherwise specified  
P
amb  
PARAMETER  
CONDITIONS  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Supply  
Supply voltage range  
Quiescent current  
note 2  
V
I
6,0  
14,4  
18,0  
V
P
40  
6,8  
80  
mA  
P
D.C. output voltage at  
approximately V /2  
note 3  
V
O
V
P
D.C. output offset  
voltage  
|V  
|
100  
mV  
5-9  
mute  
O
Mute/stand-by switch  
Switch-on voltage level  
Mute condition  
V
8,5  
3,0  
6,4  
V
V
ON  
V
V
Output signal in mute  
position  
V = 1 V (max.);  
I
f = 20 Hz to  
15 kHz  
2
mV  
D.C. output offset  
voltage  
|V  
|
0
100  
2
mV  
V
5-9  
V
Stand-by condition  
sb  
D.C. current in  
stand-by condition  
Switch-on current  
I
12  
100  
40  
µA  
µA  
sb  
I
sw  
July 1994  
6
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 watt stereo car radio  
power amplifier  
TDA1516BQ  
A.C. CHARACTERISTICS  
V = 14,4 V; R = 4 ; f = 1 kHz; T  
= 25 °C; unless otherwise specified  
P
L
amb  
PARAMETER  
CONDITIONS  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
note 1  
Stereo application  
Output power  
note 4;  
THD = 0,5%  
THD = 10%  
notes 4 and 5;  
THD = 10%  
note 4;  
P
P
4
5
W
o
5,5  
6,0  
W
o
P
6
7
W
o
Output power at  
R = 2 Ω  
THD = 0,5%  
THD = 10%  
notes 4 and 5;  
THD = 10%  
note 6;  
P
P
7.5  
10  
8,5  
11  
W
W
L
o
o
P
f
10,5  
12,0  
W
o
Low frequency roll-off  
3 dB  
1 dB  
20  
19  
45  
Hz  
L
High frequency roll-off  
Closed loop voltage gain  
Supply voltage ripple  
rejection:  
f
kHz  
dB  
H
G
20  
21  
v
note 7  
ON  
RR  
RR  
RR  
48  
48  
80  
50  
60  
75  
dB  
dB  
dB  
kΩ  
mute  
stand-by  
Input impedance  
Noise output voltage:  
ON  
|Z |  
I
note 8;  
R = 0 Ω  
V
40  
50  
70  
50  
100  
1
µV  
µV  
µV  
dB  
dB  
S
no(rms)  
ON  
R = 10 kΩ  
V
V
α
S
no(rms)  
no(rms)  
mute  
note 9  
Channel separation  
Channel balance  
R = 10 kΩ  
S
G
v
July 1994  
7
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 watt stereo car radio  
power amplifier  
TDA1516BQ  
PARAMETER  
BTL application  
CONDITIONS  
note 10  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Output power  
THD = 0,5%  
P
P
P
15,5  
17,0  
W
o
THD = 10%  
20  
21  
22  
24  
W
W
o
o
note 5; THD = 10%  
Output power at V  
= 13,2 V  
P
THD = 0,5%  
P
P
P
13,5  
17  
W
W
W
o
o
o
THD = 10%  
note 5; THD = 10%  
THD = 0,5%  
19  
Power bandwidth  
P = 15 W  
B
20 to  
Hz  
o
w
15 000  
Low frequency roll-off  
note 6;  
3 dB  
1 dB  
f
20  
25  
25  
Hz  
L
High frequency roll-off  
f
kHz  
dB  
H
Closed loop voltage gain  
G
26  
27  
v
Supply voltage ripple  
rejection:  
note 7  
ON  
RR  
RR  
RR  
48  
48  
80  
25  
30  
38  
dB  
dB  
dB  
kΩ  
mute  
stand-by  
Input impedance  
|Z |  
I
Noise output voltage  
note 8;  
ON  
R = 0 Ω  
V
70  
200  
µV  
µV  
µV  
S
no(rms)  
ON  
R = 10 kΩ  
V
V
100  
60  
S
no(rms)  
no(rms)  
mute  
note 9  
Notes to the characteristics  
1. All characteristics, for stereo application are measured using the circuit shown in Fig.3.  
2. The circuit is d.c. adjusted at V = 6 V to 18 V and a.c. operating at V = 8,5 to 18 V.  
P
P
3. At 18 V < V < 30 V the d.c. output voltage V /2.  
P
P
4. Output power is measured directly at the output pins of the IC.  
5. With bootstrap and a 100 kresistor from pin 12 to the positive supply voltage (V ), value of bootstrap capacitor is  
P
47 µF.  
6. Frequency response externally fixed.  
7. Ripple rejection measured at the output with a source impedance of 0 (maximum ripple amplitude of 2 V) and a  
frequency between 1 kHz and 10 kHz.  
8. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.  
9. Noise output voltage independent of R (V = 0 V).  
S
I
10. All characteristics, for BTL application are measured using the circuit shown in Fig.4.  
July 1994  
8
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 watt stereo car radio  
power amplifier  
TDA1516BQ  
APPLICATION INFORMATION  
Fig.3 Stereo application circuit diagram.  
Fig.4 BTL application circuit diagram (without bootstrapping).  
9
July 1994  
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 watt stereo car radio  
power amplifier  
TDA1516BQ  
PACKAGE OUTLINE  
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)  
SOT141-6  
non-concave  
x
D
h
D
E
h
view B: mounting base side  
d
A
2
B
j
E
A
L
3
L
Q
c
1
13  
e
e
m
v
M
w
M
1
Z
2
b
p
e
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
(1)  
(1)  
UNIT  
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0  
15.5 4.2 0.60 0.38 23.6 19.6  
12.2  
11.8  
3.4 12.4 2.4  
3.1 11.0 1.6  
2.00  
1.45  
2.1  
1.8  
6
mm  
10  
3.4  
1.7 5.08  
0.8  
4.3  
0.25 0.03  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-03-11  
SOT141-6  
July 1994  
10  
 
Philips Semiconductors  
Product specification  
24 W BTL or 2 x 12 watt stereo car radio  
power amplifier  
TDA1516BQ  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
SOLDERING  
Introduction  
specified maximum storage temperature (T  
). If the  
stg max  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
Repairing soldered joints  
Apply a low voltage soldering iron (less than 24 V) to the  
lead(s) of the package, below the seating plane or not  
more than 2 mm above it. If the temperature of the  
soldering iron bit is less than 300 °C it may remain in  
contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
Soldering by dipping or by wave  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joint for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
July 1994  
11  
 

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